Tsis tshua muaj Profile Copper Foil (VLP-SP/B)

Kev kho mob sub-micron micro-roughening tseem ceeb nce thaj tsam ntawm qhov chaw tsis muaj kev cuam tshuam roughness, uas yog tshwj xeeb tshaj yog pab tau kom muaj zog adhesion.


Product Detail

Khoom cim npe

Kev kho mob sub-micron micro-roughening tseem ceeb nce thaj tsam ntawm qhov chaw tsis muaj kev cuam tshuam roughness, uas yog tshwj xeeb tshaj yog pab tau kom muaj zog adhesion.Nrog siab particle adhesion, tsis muaj kev txhawj xeeb ntawm cov khoom ntog tawm thiab kis kab mob.Tus nqi Rzjis tom qab roughening yog khaws cia ntawm 1.0 µm thiab pob tshab ntawm zaj duab xis tom qab etched kuj zoo.

Paub meej

Thickness: 12um 18um 35um 50um 70um
Txuj Dav: 1290mm, Dav ntau: 200-1340mm, tuaj yeem txiav raws li qhov loj me.
Ntoo lub thawv pob
ID: 76 mm, 152 mm
Ntev: Customized
Qauv tuaj yeem muab tau

Nta

Cov ntawv kho mob yog paj yeeb lossis dub electrolytic tooj liab ntawv ntawm qhov tsawg heev roughness.Piv nrog rau cov ntawv ci electrolytic tooj liab tsis tu ncua, VLP ntawv ci no muaj cov pob zeb zoo dua, uas yog cov equiaxed nrog cov tiaj tiaj, muaj qhov roughness ntawm 0.55μm, thiab muaj cov txiaj ntsig zoo li kev ruaj ntseg zoo dua thiab muaj zog dua.Cov khoom no siv tau rau cov khoom siv high-frequency thiab high-ceev, feem ntau hloov tau lub rooj tsavxwm, lub rooj tsavxwm siab zaus, thiab cov rooj sib tham ultra-zoo.
Tsawg heev profile
Siab MIT
Zoo heev etchability

Daim ntawv thov

2 txheej 3 txheej FPC
EMI
Fine circuit pattern
Txawb xov tooj Wireless charging
High zaus board

Tej yam khoom ntawm Tsawg Profile Copper Foil

Kev faib tawm

Chav tsev

Kev xav tau

Txoj Kev Xeem

Nominal thickness

Um

12

18

35

50

70

IPC-4562A

Qhov hnyav ntawm cheeb tsam

g/m² os

107 ± 5

153 ± 7

285 ± 10

435 ± 15

585 ± 20

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Ci ntsa iab sab (Ra)

li m

≤ 0.43

IPC-TM-650 2.3.17

Matte sab (Rz)

um

≤3.0

≤3.0

≤ 3.0

≤3.0

≤3.0

Tensile zog

RT (23 ° C)

Mpa

≥300

IPC-TM-650 2.4.18

HT (180 ° C)

≥180

Elongation

RT (23 ° C)

%

≥5

≥6

≥8

≥10

≥10

IPC-TM-650 2.4.18

HT (180 ° C

≥6

≥6

≥6

≥6

≥6

Peel zog (FR-4)

N / hli

≥0.8

≥0.8

≥1.0

≥1.2

≥1.4

IPC-TM-650 2.4.8

lbs/ib

≥4.6

≥4.6

≥5.7

≥6.8

≥8.0

Pinholes & Porosity Tus lej

No

IPC-TM-650 2.1.2

Anti-oxidization RT (23 ° C) Days

180

 
HT (200 ° C)

feeb

30

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5G High zaus Board Ultra Tsawg Profile Copper Foil1

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