Low Profile Reverse Treated Copper Foil For Wireless Charging
●Thickness: 12um 18um 35um 50um 70um
●Txuj Dav: 1290mm, tuaj yeem txiav raws li qhov kev thov loj
●Ntoo lub thawv pob
●ID: 76 mm, 152 mm
●Ntev: Customized
●Tsawg profile rau FCCL
●Siab MIT
●Zoo heev etchability
●Cov ntawv kho mob yog xim liab lossis dub
●Rov qab kho tooj liab ntawv ci
●Tsis muaj arsenic, ntsuab
●2 txheej FPC
●EMI
●Txawb xov tooj Wireless charging
| Kev faib tawm | Chav tsev | Kev xav tau | Txoj Kev Xeem | |||||
| Nominal thickness | Um | 12 | 18 | 35 | 50 | 70 | IPC-4562A | |
| Qhov hnyav ntawm cheeb tsam | g/m² os | 107 ± 5 | 153 ± 7 | 285 ± 10 | 435 ± 15 | 585 ± 20 | IPC-TM-650 2.2.12.2 | |
| Purity | % | ≥99.8 | IPC-TM-650 2.3.15 | |||||
| roughness | Ci ntsa iab sab (Ra) | li m | ≤3.0 | IPC-TM-650 2.3.17 | ||||
| Matte sab (Rz) | um | ≤3.0 | ≤4.0 | ≤ 6.0 | ≤8.0 | ≤10 | ||
| Tensile zog | RT (23 ° C) | Mpa | ≥207 | ≥276 | IPC-TM-650 2.4.18 | |||
| HT (180 ° C) | ≥103 | ≥138 | ||||||
| Elongation | RT (23 ° C) | % | ≥4 | ≥4 | ≥8 | ≥10 | ≥12 | IPC-TM-650 2.4.18 |
| HT (180 ° C | ≥4 | ≥4 | ≥6 | ≥8 | ≥8 | |||
| Peel zog (FR-4) | N / hli | ≥0.7 | ≥0.8 | ≥1.0 | ≥1.2 | ≥1.3 | IPC-TM-650 2.4.8 | |
| Lbs/ib | ≥4.0 | ≥4.6 | ≥5.7 | ≥6.9 | ≥7.4 |
| ||
| Pinholes & Porosity | Tus lej | No | IPC-TM-650 2.1.2 | |||||
| Anti-oxidization | RT (23 ° C) | Days | 180 | |||||
| HT (200 ° C) | feeb | 60 | ||||||
Standard Dav, 1295 (± 1) hli, Dav ntau yam: 200-1340mm.Tej zaum raws li tus neeg thov tailor.
