5G Electrolytic Copper Ntawv Nyiaj
●Thickness: 12um 18um 35um
●Dav: 300-1300mm.stadnard dav 1290mm, tuaj yeem txiav raws li qhov loj me
●Ntoo lub thawv pob
●ID: 76 mm, 152 mm
●Ntev: Customized
●Qauv tuaj yeem muab tau
●Delivery: 10-20 hnub
●Slitting Ua Haujlwm Txheej Txheem: Ua slitting, kev faib tawm, tshuaj xyuas thiab pob raws li qhov yuav tsum tau ua kom zoo, dav thiab qhov hnyav ntawm tooj liab foils ntawm cov neeg siv khoom.
●Ultra-low profile, nrog siab tev
●Lub zog thiab zoo etchability
●Hyper low coarsening technology
●5G High zaus board
●LCP/MPI/MTPI
| Kev faib tawm | Chav tsev | Kev xav tau | Txoj Kev Xeem | ||||
| Foil Designation |
| T | H | 1 | IPC-4562A | ||
| Nominal thickness | um | 12 | 18 | 35 | IPC-4562A | ||
| Qhov hnyav ntawm cheeb tsam | g/m² os | 107±5 | 153± 7 | 285 ± 10 | IPC-TM-650 2.2.12 | ||
| Purity | % | ≥99.8 | IPC-TM-650 2.3.15 | ||||
| Rughness | Ci ntsa iab sab (Ra) | um | ≤0.43 ib | IPC-TM-650 2.2.17 | |||
| Matte sab (Rz) | um | 1.0 | txoj kev kho qhov muag | ||||
| Tensile zog | RT (23 ° C) | Mpa | ≥300 | IPC-TM-650 2.4.18 | |||
| H.T.(180° C) | ≥180 | ||||||
| Elongation | RT (23 ° C) | % | ≥5 | ≥6 | ≥8 | IPC-TM-650 2.4.18 | |
| H.T.(180° C) | ≥6 | ≥6 | ≥6 | ||||
| Peel zog (FR-4) | N / hli | ≥0.6 | ≥0.6 | ≥0.6 | IPC-TM-650 2.4.8 | ||
| Lbs/ib | ≥3.4 | ≥3.4 | ≥3.4 | ||||
| Pinholes & porosity | Tus lejs | No | IPC-TM-650 2.1.2 | ||||
| Anti-oxidization | RT (23 ° C) | Hnub | 90 |
| |||
| H.T.(200° C) | feeb | 40 | |||||
Standard Dav, 1295 (± 1) hli, Dav ntau yam: 200-1340mm.Tej zaum raws li tus neeg thov tailor.
