Hyper Very Low Profile Copper Foil Rau Kev Kub Ceev Digital

Thickness: 12um 18um 35um

Txheem dav: 1290mm, Max.dav 1340mm;tuaj yeem txiav raws li qhov kev thov loj

Ntoo lub thawv pob


Product Detail

Khoom cim npe

Nta

Ultra tsis tshua muaj profile nrog siab tev lub zog thiab zoo etch muaj peev xwm
Siv Low coarsening thev naus laus zis, microstructure ua rau nws yog ib qho khoom siv zoo heev los siv rau kev sib kis ntau zaus
Cov ntawv kho mob yog xim liab

Tej daim ntawv thov

High zaus kis tau tus mob Circuit Court
Base chaw nres tsheb / Server
Kev kub ceev digital
PPO/PPE

Yam khoom ntawm Hyper Heev Tsawg profile Copper Foil

Kev faib tawm

Chav tsev

Txoj Kev Xeem

Tyog Method

Nominal thickness

Um

12

18

35

IPC-4562A

Qhov hnyav ntawm cheeb tsam

g/m² os

107 ± 5

153 ± 7

285 ± 10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Ci ntsa iab sab (Ra)

li m

≤ 0.43

≤ 0.43

≤ 0.43

IPC-TM-650 2.3.17

Matte sab (Rz)

um

1.5-2.0 Nws

1.5-2.0 Nws

1.5-2.0 Nws

 

Tensile zog

RT (23 ° C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

HT (180 ° C)

≥180

≥180

≥180

 

Elongation

RT (23 ° C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

HT (180 ° C)

≥6

≥6

≥6

 

Pinholes & Porosity

Tus lej

No

IPC-TM-650 2.1.2

Peel zog

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650 2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

RT (23 ° C)

Hnub

90

 

RT (200 ° C)

feeb

40

 
5G High zaus Board Ultra Tsawg Profile Copper Foil1

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  • Sau koj cov lus ntawm no thiab xa tuaj rau peb