Tsis tshua muaj Profile Copper Foil (VLP-SP/B)
Kev kho mob sub-micron micro-roughening tseem ceeb nce thaj tsam ntawm qhov chaw tsis muaj kev cuam tshuam roughness, uas yog tshwj xeeb tshaj yog pab tau kom muaj zog adhesion.Nrog siab particle adhesion, tsis muaj kev txhawj xeeb ntawm cov khoom ntog tawm thiab kis kab mob.Tus nqi Rzjis tom qab roughening yog khaws cia ntawm 1.0 µm thiab pob tshab ntawm zaj duab xis tom qab etched kuj zoo.
●Thickness: 12um 18um 35um 50um 70um
●Txuj Dav: 1290mm, Dav ntau: 200-1340mm, tuaj yeem txiav raws li qhov loj me.
●Ntoo lub thawv pob
●ID: 76 mm, 152 mm
●Ntev: Customized
●Qauv tuaj yeem muab tau
Cov ntawv kho mob yog paj yeeb lossis dub electrolytic tooj liab ntawv ntawm qhov tsawg heev roughness.Piv nrog rau cov ntawv ci electrolytic tooj liab tsis tu ncua, VLP ntawv ci no muaj cov pob zeb zoo dua, uas yog cov equiaxed nrog cov tiaj tiaj, muaj qhov roughness ntawm 0.55μm, thiab muaj cov txiaj ntsig zoo li kev ruaj ntseg zoo dua thiab muaj zog dua.Cov khoom no siv tau rau cov khoom siv high-frequency thiab high-ceev, feem ntau hloov tau lub rooj tsavxwm, lub rooj tsavxwm siab zaus, thiab cov rooj sib tham ultra-zoo.
●Tsawg heev profile
●Siab MIT
●Zoo heev etchability
●2 txheej 3 txheej FPC
●EMI
●Fine circuit pattern
●Txawb xov tooj Wireless charging
●High zaus board
| Kev faib tawm | Chav tsev | Kev xav tau | Txoj Kev Xeem | |||||
| Nominal thickness | Um | 12 | 18 | 35 | 50 | 70 | IPC-4562A | |
| Qhov hnyav ntawm cheeb tsam | g/m² os | 107 ± 5 | 153 ± 7 | 285 ± 10 | 435 ± 15 | 585 ± 20 | IPC-TM-650 2.2.12.2 | |
| Purity | % | ≥99.8 | IPC-TM-650 2.3.15 | |||||
| roughness | Ci ntsa iab sab (Ra) | li m | ≤ 0.43 | IPC-TM-650 2.3.17 | ||||
| Matte sab (Rz) | um | ≤3.0 | ≤3.0 | ≤ 3.0 | ≤3.0 | ≤3.0 | ||
| Tensile zog | RT (23 ° C) | Mpa | ≥300 | IPC-TM-650 2.4.18 | ||||
| HT (180 ° C) | ≥180 | |||||||
| Elongation | RT (23 ° C) | % | ≥5 | ≥6 | ≥8 | ≥10 | ≥10 | IPC-TM-650 2.4.18 |
| HT (180 ° C | ≥6 | ≥6 | ≥6 | ≥6 | ≥6 | |||
| Peel zog (FR-4) | N / hli | ≥0.8 | ≥0.8 | ≥1.0 | ≥1.2 | ≥1.4 | IPC-TM-650 2.4.8 | |
| lbs/ib | ≥4.6 | ≥4.6 | ≥5.7 | ≥6.8 | ≥8.0 | |||
| Pinholes & Porosity | Tus lej | No | IPC-TM-650 2.1.2 | |||||
| Anti-oxidization | RT (23 ° C) | Days | 180 | |||||
| HT (200 ° C) | feeb | 30 | / | |||||
