Tsawg heev Profile Tooj Liab Ntawv Nyiaj (VLP-SP / B)

Subp-micron micro rougening kev kho mob nce ntau qhov chaw yam tsis muaj kev cuam tshuam txog kev ntxhib, uas yog qhov tshwj xeeb tshaj yog rau kev ua kom muaj zog zuj zus.


Khoom Qhia Qhia

Khoom Ntawv

Subp-micron micro rougening kev kho mob nce ntau qhov chaw yam tsis muaj kev cuam tshuam txog kev ntxhib, uas yog qhov tshwj xeeb tshaj yog rau kev ua kom muaj zog zuj zus. Nrog siab particle adhesion, tsis muaj kev txhawj xeeb ntawm cov me me poob tawm thiab cov kab tsis huv. Tus nqi rzjis tom qab roughen yog tswj ntawm 1.0 μm thiab transparency ntawm zaj yeeb yaj kiab tom qab tau etched kuj zoo.

Me mem quav naim

Thickness: 12um 18um 50um 500um
Txheem Dav: 1290mm, thaj tsam dav, thaj tsam dav: 200-1340, tuaj yeem txiav raws li qhov loj thov.
Ntoo lub thawv pob
ID: 76 hli, 152 hli
Ntev: Mekas
Qauv tuaj yeem muab tau

Nta

Kho cov ntawv ci yog xim liab lossis dub electrolytic tooj liab ntawv nyiaj ntawm qhov chaw tsis tshua muaj roughness. Piv nrog li niaj zaus electrolytic tooj liab ntawv ci, qhov no muaj cov muaj tseeb, muaj qhov sib luag ntawm 0.55μm, thiab muaj cov kev sib daj sib luag zoo dua li muaj zog dua thiab muaj kev nyuaj siab dua. Cov khoom lag luam no yog siv rau cov khoom siv hluav taws xob siab thiab cov khoom siv ceev, feem ntau cov rooj tsav tsheb hluav taws xob, thiab cov laug cam hluav taws xob.
Tsawg heev profile
Siab mit
Zoo heev etchability

Daim ntawv thov

2Layer 3layer FPC
EMI
Zoo Circuit Court Circuit Court
Txawb xov tooj txawb Wireless them
High Frequency Board

Raug cov khoom ntawm qhov tsis tshua muaj profile tooj liab ntawv nyiaj

Kev sib faib

Ib yam

Qhov toob kas

Txoj kev xeem

Nominal tuab

Um

12

18

35

50

70

IPC-4562A

Thaj chaw hnyav

g / m²

107 ± 5

153 ± 7

285 ± 10

435 ± 15

585 ± 20

IPC-TM-650 2.2.12.2

Kev coj dawb huv

%

≥99.8

IPC-TM-650 2.3.15

kev ntxhib

Ci iab sab (RA)

ս m

I≤0.43

IPC-TM-650 2.3.17

Matte sab (rz)

um

I≤3.0

I≤3.0

≤3.0

I≤3.0

I≤3.0

Lub zog tensile

RT (23 ° C)

MPa

≥300

IPC-TM-650 2.4.18

Ht (180 ° C)

≥180

Elongation

RT (23 ° C)

%

≥5

≥6

≥8

≥10

≥10

IPC-TM-650 2.4.18

Ht (180 ° C

≥6

≥6

≥6

≥6

≥6

Tev lub zog (FR-4)

N / hli

≥0.8

≥0.8

≥1.0

≥1.2

4

IPC-TM-650 2.4.8

lbs / nyob rau hauv

≥4.6

≥4.6

≥.7

≥6.8

≥8.0

Pinholes & Porosos Tooj

No

IPC-TM-650 2.1.2

Los tiv thaiv-oxidization RT (23 ° C) Dnyob hoom

180

 
Ht (200 ° C)

Feeb

30

/

5g High Furreecency Board Ultra Tsawg Prof Profile Tooj Liab Ntawv Cold1

  • Yav dhau los:
  • Tom ntej:

  • Sau koj cov lus ntawm no thiab xa mus rau peb