Electrolytic tooj liab ntawv ci
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Tsis tshua muaj Profile Copper Foil (VLP-SP/B)
Kev kho mob sub-micron micro-roughening tseem ceeb nce thaj tsam ntawm qhov chaw tsis muaj kev cuam tshuam roughness, uas yog tshwj xeeb tshaj yog pab tau kom muaj zog adhesion.
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HTE High Temperature Elongation Copper Foil
●Thickness: 12um 15um 18um 35um 70um 105um
●Txuj Dav: 1290mm, tuaj yeem txiav raws li qhov loj me
●Ntoo lub thawv pob
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Rov qab kho Electrolytic Copper Foil
Electron microscope thiab lub zog disperse spectroscopy cov cuab yeej lav qhov zoo ntawm cov khoom kawg ua ntej xa khoom.
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Low Profile Reverse Treated Copper Foil For Wireless Charging
●Thickness: 12um 18um 35um 50um 70um
●Txuj Dav: 1290mm, tuaj yeem txiav raws li qhov kev thov loj.
●Ntoo lub thawv pob
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Lub Tsheb Hluav Taws Xob Li-ion Roj Teeb Ob Sab Ci Copper Foil
●Glossy ob sab superior rupture endurance
●Cov khoom ruaj khov haum rau cov roj teeb uas muaj peev xwm rechargeable
●Eco-phooj ywg cov khoom thiab cov txheej txheem
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Rov qab kho Copper Foil
JIMA Copper txais kev ua haujlwm siab tshaj plaws kev ua haujlwm thiab kev tswj xyuas lub tswv yim los siv kev tswj xyuas nruj thiab kev tshawb fawb rau kev tsim cov ntawv ci tooj liab.
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Hyper Heev Tsawg Profile Copper Foil Rau Kev Siv Hluav Taws Xob
Slitting Ua Haujlwm Txheej Txheem: Ua slitting, kev faib tawm, tshuaj xyuas thiab pob raws li qhov yuav tsum tau ua kom zoo, dav thiab qhov hnyav ntawm tooj liab foils ntawm cov neeg siv khoom.
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Low Coarsening Reverse Treated Copper Foil
Raws li rov qab kho cov ntawv ci tooj liab, cov khoom no muaj kev ua haujlwm zoo dua qub.Nws tuaj yeem ua kom luv luv ntawm cov txheej txheem tsim khoom, ua tiav qhov nrawm dua thiab nrawm micro-etching, thiab txhim kho tus nqi ntawm PCBs.
