Hyper Heev Tsawg Profile Copper Foil Rau Kev Siv Hluav Taws Xob

Slitting Ua Haujlwm Txheej Txheem: Ua slitting, kev faib tawm, tshuaj xyuas thiab pob raws li qhov yuav tsum tau ua kom zoo, dav thiab qhov hnyav ntawm tooj liab foils ntawm cov neeg siv khoom.


Product Detail

Khoom cim npe

JIMA Copper proprietary ultra low roughness kev kho cov txheej txheem ua kom muaj zog adhesion zoo rau cov ntaub ntawv Dk tsawg, uas lub zog adhesion nyuaj ua tiav, tsis muaj kev cuam tshuam cov khoom sib kis.Vim lub recrystallized puag ntawv ci, nws kuj muaj superior dabtsi yog khoov yam ntxwv rau kev pab mus rau tiam tom ntej ntawm saj zawg zog luam ntawv circuits.

Paub meej

Thickness: 12um 18um 35um
Txuj Dav: 1290mm, tuaj yeem txiav raws li qhov loj me.
Ntoo lub thawv pob
ID: 76 mm, 152 mm
Ntev: Customized
Qauv tuaj yeem muab tau
Lub sij hawm xa tuaj: 15-20 hnub
High precision txiav cov cuab yeej txiav tooj liab foils raws li dav xav tau los ntawm cov neeg siv khoom.
Slitting Ua Haujlwm Txheej Txheem: Ua slitting, kev faib tawm, tshuaj xyuas thiab pob raws li qhov yuav tsum tau ua kom zoo, dav thiab qhov hnyav ntawm tooj liab foils ntawm cov neeg siv khoom.

Nta

Ultra-low profile, nrog siab tev
Lub zog thiab zoo etchability
Tsawg coarsening tshuab

Daim ntawv thov

Kev kub ceev digital
Base chaw nres tsheb / server
PPO/PPE
Siv Low coarsening thev naus laus zis, lub microstructure ua rau nws cov khoom siv zoo heev los siv rau kev sib kis ntau zaus.
High zaus kis tau tus mob Circuit Court / High Speed ​​Transmission.

Yam khoom ntawm Hyper Heev Tsawg Profile Copper Foil

Kev faib tawm

Chav tsev

Kev xav tau

Txoj Kev Xeem

Foil Designation

 

T

H

1

IPC-4562A

Nominal thickness

um

12

18

35

IPC-4562A

Qhov hnyav ntawm cheeb tsam

g/m² os

107±5

153± 7

285 ± 10

IPC-TM-650 2.2.12

Purity

%

≥99.8

IPC-TM-650 2.3.15

Rughness

Ci ntsa iab sab (Ra)

um

≤ 0.43

IPC-TM-650 2.2.17

Matte sab (Rz)

um

1.5-2.0 Nws

txoj kev kho qhov muag

Tensile zog

RT (23 ° C)

Mpa

300

IPC-TM-650 2.4.18

H.T.(180° C)

180

Elongation

RT (23 ° C)

%

5

6

8

IPC-TM-650 2.4.18

H.T.(180° C)

6

6

6

Peel zog (FR-4)

N / hli

0.6

0.8 ua

≥1.0

IPC-TM-650 2.4.8

Lbs/ib

3.4

4.6

5.7

Pinholes & porosity

Tus lejs

No

IPC-TM-650 2.1.2

Anti-oxidization

RT (23 ° C)

Hnub

90

 

H.T.(200° C)

feeb

40

 

Txheem dav, 1295 (± 1) hli, Dav ntau yam: 200-1340mm.Tej zaum raws li tus neeg thov tailor.

5G High zaus Board Ultra Tsawg Profile Copper Foil1

  • Yav dhau los:
  • Tom ntej:

  • Sau koj cov lus ntawm no thiab xa tuaj rau peb