Hyper Very Low Profile Copper Foil Rau Kev Kub Ceev Digital
●Ultra tsis tshua muaj profile nrog siab tev lub zog thiab zoo etch muaj peev xwm
●Siv Low coarsening thev naus laus zis, microstructure ua rau nws yog ib qho khoom siv zoo heev los siv rau kev sib kis ntau zaus
●Cov ntawv kho mob yog xim liab
●High zaus kis tau tus mob Circuit Court
●Base chaw nres tsheb / Server
●Kev kub ceev digital
●PPO/PPE
| Kev faib tawm | Chav tsev | Txoj Kev Xeem | Tyog Method | |||
| Nominal thickness | Um | 12 | 18 | 35 | IPC-4562A | |
| Qhov hnyav ntawm cheeb tsam | g/m² os | 107 ± 5 | 153 ± 7 | 285 ± 10 | IPC-TM-650 2.2.12.2 | |
| Purity | % | ≥99.8 | IPC-TM-650 2.3.15 | |||
| Roughness | Ci ntsa iab sab (Ra) | li m | ≤ 0.43 | ≤ 0.43 | ≤ 0.43 | IPC-TM-650 2.3.17 |
| Matte sab (Rz) | um | 1.5-2.0 Nws | 1.5-2.0 Nws | 1.5-2.0 Nws |
| |
| Tensile zog | RT (23 ° C) | Mpa | ≥300 | ≥300 | ≥300 | IPC-TM-650 2.4.18 |
| HT (180 ° C) | ≥180 | ≥180 | ≥180 |
| ||
| Elongation | RT (23 ° C) | % | ≥5 | ≥6 | ≥8 | IPC-TM-650 2.4.18 |
| HT (180 ° C) | ≥6 | ≥6 | ≥6 |
| ||
| Pinholes & Porosity | Tus lej | No | IPC-TM-650 2.1.2 | |||
| Peel zog | N/mm | ≥0.6 | ≥0.8 | ≥1.0 | IPC-TM-650 2.4.8 | |
| Lbs/in | ≥3.4 | ≥4.6 | ≥5.7 | |||
| Anti-oxidization | RT (23 ° C) | Hnub | 90 |
| ||
| RT (200 ° C) | feeb | 40 | ||||
