Rov qab kho Electrolytic Copper Foil

Electron microscope thiab lub zog disperse spectroscopy cov cuab yeej lav qhov zoo ntawm cov khoom kawg ua ntej xa khoom.


Product Detail

Khoom cim npe

Paub meej

Thickness: 12um 18um 35um 70um
Standard Dav: 1290mm, ntau yam: 300-1300mm, tuaj yeem txiav raws li qhov loj me.
Ntoo lub thawv pob
ID: 76 mm, 152 mm
Ntev: Customized
Qauv tuaj yeem muab tau
High precision txiav cov cuab yeej txiav tooj liab foils raws li dav xav tau los ntawm cov neeg siv khoom.
Electron microscope thiab lub zog disperse spectroscopy cov cuab yeej lav qhov zoo ntawm cov khoom kawg ua ntej xa khoom.

Nta

Rov qab kho tooj liab ntawv ci
Tsawg profile, nrog siab tawv tawv
Zoo heev etchability
Cov ntawv kho mob yog xim liab

Daim ntawv thov

High zaus, thov rau hydrocarbon board
Siab Tg
Fine circuit pattern

Cov yam ntxwv ntawm Reverse Treated Electrolytic Copper Foil

Kev faib tawm

Chav tsev

Kev xav tau

 

 

 

Txoj Kev Xeem

Nominal thickness

um

12

18

35

70

IPC-4562A

Qhov hnyav ntawm cheeb tsam

g/m² os

107±5

153± 7

285 ± 10

585± 20

IPC-TM-650 2.2.12

Purity

%

≥99.8

IPC-TM-650 2.3.15

Rughness

Ci ntsa iab sab (Ra)

um

4.0

IPC-TM-650 2.2.17

Matte sab (Rz)

um

5.0

6.0

8.0 ib

≤10

Tensile zog

RT (23 ° C)

Mpa

276

IPC-TM-650 2.4.18

H.T.(180° C)

138

Elongation

RT (23 ° C)

%

4

4

8

12

IPC-TM-650 2.4.18

H.T.(180° C)

3

4

4

4

Peel zog (FR-4)

N / hli

≥1.0

≥1.2

≥1.4

≥1.8

IPC-TM-650 2.4.8

Lbs/ib

≥5.7

7.4 ib

≥8.0

10.2

Pinholes & porosity

Tus lejs

No

IPC-TM-650 2.1.2

Anti-oxidization

RT (23 ° C)

Hnub

90

 

H.T.(200° C)

feeb

40

 

Standard Dav, 1295 (± 1) hli, Dav ntau yam: 200-1340mm.Tej zaum raws li tus neeg thov tailor.

Dawb Profile Copper Foil rau Graphene Carrier

  • Yav dhau los:
  • Tom ntej:

  • Sau koj cov lus ntawm no thiab xa tuaj rau peb