Ob Chav Sab Kho Copper Ntawv Nyiaj Rau HDI
●Thickness: 12um 18um 35um 70um
●Txuj Dav: 1290mm, Peb tuaj yeem txiav raws li qhov xav tau loj
●ID: 76 mm, 152 mm
●Ntev: Customized
●Qauv tuaj yeem muab tau;Lub sij hawm xa tuaj: 7 hnub
●Lub sij hawm xa tuaj: 15-20 hnub
●Ntim cov ntsiab lus: Export Ntoo thawv
●Lub sij hawm: FOB, CIF.
●Kev Them Nyiaj: 50% T / T tso nyiaj, tshuav nyiaj them ua ntej xa khoom.
●Kev ua haujlwm siab ua cov khoom pov tseg ua cov txheej txheem ntawm cov ntawv ci tooj liab.
●Ob sab kho Copper ntawv ci
●Nrog siab khi quab yuam rau laminate
●Direct multi-layer lamination
●Zoo etchability
●Cov ntawv kho mob yog xim liab
●Multilayer Printed Circuit Board
●HDI (High Density Interconnector) rau PCB
| Kev faib tawm | Chav tsev | Kev xav tau | Txoj Kev Xeem | ||||||
| Foil Designation |
| T | H | 1 | 2 | IPC-4562A | |||
| Nominal thickness | um | 12 | 18 | 35 | 70 | IPC-4562A | |||
| Qhov hnyav ntawm cheeb tsam | g/m² os | 107±5 | 153± 7 | 285 ± 10 | 585 ib± 20 | IPC-TM-650 2.2.12 | |||
| Purity | % | ≥99.8 | IPC-TM-650 2.3.15 | ||||||
| Rughness | Ci ntsa iab sab (Ra) | um | ≤3.0 | IPC-TM-650 2.2.17 | |||||
| Matte sab (Rz) | um | ≤6 | ≤8 | ≤10 | ≤15 | ||||
| Tensile zog | RT (23 ° C) | Mpa | ≥207 | ≥207 | ≥276 | ≥276 | IPC-TM-650 2.4.18 | ||
| H.T.(180° C) | ≥103 | ≥103 | ≥138 | ≥138 | |||||
| Elongation | RT (23 ° C) | % | ≥2 | ≥2 | ≥3 | ≥3 | IPC-TM-650 2.4.18 | ||
| H.T.(180° C) | ≥2 | ≥2 | ≥2 | ≥3 | |||||
| Kev tiv thaiv | Ωg /m² | ≤0.170 ib | ≤0.166 ib | ≤0.162 ib | ≤0.162 ib | IPC-TM-650 2.5.14 | |||
| Peel zog (FR-4) | S sab | N / hli | ≥0.9 | ≥0.9 | ≥1.4 | ≥1.4 | IPC-TM-650 2.4.8 | ||
| Lbs/ib | ≥5.1 | ≥6.3 | ≥8.0 ib | ≥8.0 ib | |||||
| M sab | N / hli | ≥0.9 | ≥1.1 | ≥1.4 | ≥2.0 | ||||
| Lbs/ib | ≥5.1 | ≥6.3 | ≥8.0 ib | ≥11.4 | |||||
| Pinholes & porosity | Tus lejs | No | IPC-TM-650 2.1.2 | ||||||
| Anti-oxidization | RT (23 ° C) | Hnub | 180 | / | |||||
| H.T.(200° C) | feeb | 40 | / | ||||||
Txheem dav, 1295 (± 1) hli, Dav ntau yam: 200-1340mm.Tej zaum raws li tus neeg thov tailor.
PCB Copper Foil Duab
