Ultra Low Profile Copper Foil Rau 5G High zaus Board
Cov ntawv ci nyoos, uas muaj lub ntsej muag glossy nrog ultra tsawg roughness ntawm ob sab, yog kho nrog JIMA Copper proprietary micro-roughening txheej txheem kom ua tiav cov kev ua haujlwm siab anchoring thiab kuj ultra tsawg roughness.Nws muaj kev ua tau zoo nyob rau hauv ntau qhov chaw, los ntawm cov ntawv luam tawm nruj heev uas ua rau muaj qhov tseem ceeb ntawm cov khoom sib kis thiab kev tsim cov qauv zoo rau cov ntawv luam tawm yooj yim uas ua kom pom tseeb.
●Ultra low profile nrog siab tev lub zog thiab zoo etch muaj peev xwm.
●Hyper Low coarsening thev naus laus zis, microstructure ua rau nws yog ib qho khoom siv zoo heev los siv rau kev sib kis ntau zaus.
●Cov ntawv kho mob yog xim liab.
●High zaus kis tau tus mob Circuit Court
●Base chaw nres tsheb / Server
●Kev kub ceev digital
●PPO/PPE
| Kev faib tawm | Chav tsev | Txoj Kev Xeem | Tyog Method | |||
| Nominal thickness | Um | 12 | 18 | 35 | IPC-4562A | |
| Qhov hnyav ntawm cheeb tsam | g/m² os | 107 ± 5 | 153 ± 7 | 285 ± 10 | IPC-TM-650 2.2.12.2 | |
| Purity | % | ≥99.8 | IPC-TM-650 2.3.15 | |||
| Roughness | Ci ntsa iab sab (Ra) | li m | ≤ 0.43 | ≤ 0.43 | ≤ 0.43 | IPC-TM-650 2.3.17 |
| Matte sab (Rz) | um | 1.5-2.0 Nws | 1.5-2.0 Nws | 1.5-2.0 Nws |
| |
| Tensile zog | RT (23 ° C) | Mpa | ≥300 | ≥300 | ≥300 | IPC-TM-650 2.4.18 |
| HT (180 ° C) | ≥180 | ≥180 | ≥180 |
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| Elongation | RT (23 ° C) | % | ≥5 | ≥6 | ≥8 | IPC-TM-650 2.4.18 |
| HT (180 ° C) | ≥6 | ≥6 | ≥6 |
| ||
| Pinholes & Porosity | Tus lej | No | IPC-TM-650 2.1.2 | |||
| Peel zog | N/mm | ≥0.6 | ≥0.8 | ≥1.0 | IPC-TM-650 2.4.8 | |
| Lbs/in | ≥3.4 | ≥4.6 | ≥5.7 | |||
| Anti-oxidization | RT (23 ° C) | Hnub | 90 |
| ||
| RT (200 ° C) | feeb | 40 | ||||
