Tsawg Profile Copper Foil (LP -SP / B)
●Thickness: 12um 18um 25um 35um 50um 70um 105um
●Txuj Dav: 1290mm, tuaj yeem txiav raws li qhov loj me
●Ntoo lub thawv pob
●ID: 76 mm, 152 mm
●Ntev: Customized
●Qauv tuaj yeem muab tau
Cov ntawv ci no feem ntau yog siv rau ntau txheej PCBs thiab high-density Circuit Court boards, uas yuav tsum tau qhov roughness ntawm cov ntawv ci kom qis dua li cov ntawv ci tooj liab li niaj zaus kom lawv cov kev ua yeeb yam xws li tev tawm tuaj yeem nyob rau theem siab.Nws belongs rau qeb tshwj xeeb ntawm electrolytic tooj liab ntawv nyiaj nrog roughness tswj.Piv nrog rau cov ntawv ci electrolytic tooj liab tsis tu ncua, cov muaju ntawm LP tooj liab ntawv ci yog cov nplej zoo heev (<2/zm).Lawv muaj lamellar crystals es tsis txhob ntawm columnar sawv daws yuav, thaum lawv feature tiaj tus ridges thiab ib tug tsawg theem ntawm nto roughness.Lawv muaj xws li qhov zoo li qhov loj me stability thiab siab dua hardness.
●Tsawg profile rau FCCL
●Siab MIT
●Zoo heev etchability
●Cov ntawv kho mob yog xim liab lossis dub
●3 txheej FCCL
●EMI
| Kev faib tawm | Chav tsev | Kev xav tau | Txoj Kev Xeem | ||||||||
| Nominal thickness | Um | 12 | 18 | 25 | 35 | 50 | 70 | 105 | IPC-4562A | ||
| Qhov hnyav ntawm cheeb tsam | g/m² os | 107 ± 5 | 153 ± 7 | 225 ± 8 | 285 ± 10 | 435 ± 15 | 585 ± 20 | 870 ± 30 | IPC-TM-650 2.2.12.2 | ||
| Purity | % | ≥99.8 | IPC-TM-650 2.3.15 | ||||||||
| roughness | Ci ntsa iab sab (Ra) | li m | ≤ 0.43 | IPC-TM-650 2.3.17 | |||||||
| Matte sab (Rz) | um | ≤4.5 | ≤5.0 | ≤ 6.0 | ≤ 7.0 | ≤8.0 | ≤12 | ≤14 | |||
| Tensile zog | RT (23 ° C) | Mpa | ≥207 | ≥276 | IPC-TM-650 2.4.18 | ||||||
| HT (180 ° C) | ≥138 | ||||||||||
| Elongation | RT (23 ° C) | % | ≥4 | ≥4 | ≥5 | ≥8 | ≥10 | ≥12 | ≥12 | IPC-TM-650 2.4.18 | |
| HT (180 ° C | ≥4 | ≥4 | ≥5 | ≥6 | ≥8 | ≥8 | ≥8 | ||||
| Resistivity | Ω g/m² | ≤0.170 | ≤0.1 66 |
| ≤0.16 2 |
| ≤0.16 2 | ≤0.16 2 | IPC-TM-650 2.5.14 | ||
| Peel zog (FR-4) | N / hli | ≥1.0 | ≥1.3 |
| ≥1.6 |
| ≥1.6 | ≥ 2.1 | IPC-TM-650 2.4.8 | ||
| Pinholes & Porosity | Tus lej |
|
| No | IPC-TM-650 2.1.2 | ||||||
| Anti-oxidization | RT (23 ° C) | Days |
|
| 180 | ||||||
| HT (200 ° C) | feeb |
|
| 30 | |||||||
Txheem dav, 1295 (± 1) hli, Dav ntau yam: 200-1340mm.Tej zaum raws li tus neeg thov tailor.
