Low Coarsening Reverse Treated Electrolytic Copper Foil
●Thickness: 12um 18um 35um 70um 105um
●Txuj Dav: 1290mm, tuaj yeem txiav raws li qhov loj me
●Ntoo lub thawv pob
●ID: 76 mm, 152 mm
●Ntev: Customized
●Qauv tuaj yeem muab tau
●Tsawg Carbon Tsim: JIMA Copper yog ib hom khoom siv tshiab thiab tseem ceeb txuas lub teb chaws "tsawg carbon txoj kev loj hlob" lub tswv yim tshiab kev lag luam, JIMA Copper tseem txhawb nqa cov ntsiab lus qis carbon ib puag ncig tiv thaiv los ntawm kev yuav cov khoom siv raw, kev tsim khoom thiab muag khoom thiab niaj hnub siv tshuab tshiab, cov cuab yeej tshiab los txhim kho kev ua haujlwm thiab kev ua haujlwm ntau lawm thiab ua rau txhua hom kev ntsuas ntsuas mus txog qib siab hauv kev lag luam hauv kev txuag hluav taws xob thiab txo qis emission.
●Rov qab kho tooj liab ntawv ci
●Tsawg profile
●Siab MIT
●Zoo etchability
●Cov ntawv kho mob yog xim liab
●Multilayer board
●Ntau zaus
●EMI
| Kev faib tawm | Chav tsev | Kev xav tau | Txoj Kev Xeem | ||||||
| Nominal thickness | um | 12 | 18 | 35 | 70 | 105 | IPC-4562A | ||
| Qhov hnyav ntawm cheeb tsam | g/m² os | 107±5 | 153± 7 | 285 ± 10 | 585 ib± 20 | 870 ib±30 | IPC-TM-650 2.2.12 | ||
| Purity | % | ≥99.8 | IPC-TM-650 2.3.15 | ||||||
| Rughness | Ci ntsa iab sab (Ra) | um | ≤3.0 | IPC-TM-650 2.2.17 | |||||
| Matte sab (Rz) | um | ≤5.0 | ≤6.0 | ≤8.0 ib | ≤10 | ≤12. | |||
| Tensile zog | RT (23 ° C) | Mpa | ≥207 | ≥276 | IPC-TM-650 2.4.18 | ||||
| H.T.(180° C) | ≥103 | ≥138 | |||||||
| Elongation | RT (23 ° C) | % | ≥2 | ≥2 | ≥3 | ≥3 | ≥4 | IPC-TM-650 2.4.18 | |
| H.T.(180° C) | ≥2 | ≥2 | ≥2 | ≥3 | ≥3 | ||||
| Peel zog (FR-4) | N / hli | ≥0.7 ua | ≥0.8 ua | ≥1.0 | ≥1.2 | ≥1.4 | IPC-TM-650 2.4.8 | ||
| Lbs/ib | ≥4.0 | ≥4.6 | ≥5.7 | ≥7.4 ib | ≥8.0 ib | ||||
| Pinholes & porosity | Tus lejs | No | IPC-TM-650 2.1.2 | ||||||
| Anti-oxidization | RT (23 ° C) | Hnub | 180 |
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| H.T.(200° C) | feeb | 40 | |||||||
Txheem dav, 1295 (± 1) hli, Dav ntau yam: 200-1340mm.Tej zaum raws li tus neeg thov tailor.
