Low Coarsening Reverse Treated Copper Foil
●Thickness: 12um 18um 35um 70um
●Txuj Dav: 1290mm, peb tuaj yeem ua txiav raws li qhov yuav tsum tau ua
●Ntoo lub thawv pob
●ID: 76 mm, 152 mm
●Ntev: Customized
●Qauv tuaj yeem muab tau
●Lub sij hawm xa tuaj: 15-30 hnub
●Lub sij hawm: FOB, CIF ...
●Kev Them Nyiaj: 50% T / T tso nyiaj, tshuav nyiaj them ua ntej xa khoom.
●Rov qab kho tooj liab ntawv ci
●Tsawg profile, nrog siab tawv tawv
●Cov ntawv kho mob yog xim liab
●Raws li rov qab kho cov ntawv ci tooj liab, cov khoom no muaj kev ua haujlwm zoo dua qub.Nws tuaj yeem ua kom luv luv ntawm cov txheej txheem tsim khoom, ua tiav qhov nrawm dua thiab nrawm micro-etching, thiab txhim kho tus nqi ntawm PCBs.
●High zaus, Ultra-high zaus, thov rau PPE board
●Fine circuit pattern
●Nws yog tsuas yog siv nyob rau hauv multilayered boards thiab high-frequency boards.
Kev faib tawm | Chav tsev | Kev xav tau | Txoj Kev Xeem | |||||
Nominal thickness | um | 12 | 18 | 35 | 70 | IPC-4562A | ||
Qhov hnyav ntawm cheeb tsam | g/m² os | 107±5 | 153± 7 | 285 ± 10 | 585 ib± 20 | IPC-TM-650 2.2.12 | ||
Purity | % | ≥99.8 | IPC-TM-650 2.3.15 | |||||
Rughness | Ci ntsa iab sab (Ra) | um | 3.0 | IPC-TM-650 2.2.17 | ||||
Matte sab (Rz) | um | ≤5.0 | ≤6.0 | ≤8.0 ib | ≤10 | |||
Tensile zog | RT (23 ° C) | Mpa | ≥276 | IPC-TM-650 2.4.18 | ||||
H.T.(180° C) | ≥138 | |||||||
Elongation | RT (23 ° C) | % | ≥4 | ≥4 | ≥8 | ≥12 | IPC-TM-650 2.4.18 | |
H.T.(180° C) | ≥3 | ≥4 | ≥4 | ≥4 | ||||
Peel zog (FR-4) | N / hli | ≥1.0 | ≥1.2 | ≥1.4 | ≥1.8 | IPC-TM-650 2.4.8 | ||
Lbs/ib | ≥5.7 | ≥7.4 ib | ≥8.0 ib | ≥10.2 | ||||
Pinholes & porosity | Tus lejs | No | IPC-TM-650 2.1.2 | |||||
Anti-oxidization | RT (23 ° C) | Hnub | 90 |
| ||||
H.T.(200° C) | feeb | 30 |
Txheem dav, 1295 (± 1) hli, Dav ntau yam: 200-1340mm.Tej zaum raws li tus neeg thov tailor.
Electrolytic tooj liab foil Image